IEEE 3篇
【篇 号】：1
【作 者】：Hashimoto, T.; Kinda, A.; Kasaliara, R.; Ogawa, I.; Shuto, Y.; Yanagisawa, M.; Obki, A.; Mino, S.; Ishii, M.; Suzuki, Y.; Nagase, R.; Kilagawa, T.
【题 名】：A bidirectional single fiber 1.25 Gb/s optical transceiver module with SFP package using PLC
【期刊，年份，卷（期），起止页码】：Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Volume , Issue , May 27-30, 2003 Page(s): 279 - 283
【全文链接或论文所属数据库】：
http://ieeexplore.ieee.org/Xplor ... &isnumber=27358
【篇 号】：2
【作 者】：Ichino, M.; Yoshikawa, S.; Oomori, H.; Maeda, Y.; Nishiyama, N.; Takayama, T.; Mizue, T.; Tounai, I.; Nishie, M.
【题 名】：Small form factor pluggable optical transceiver module with extremely low power consumption for dense wavelength division multiplexing applications
【期刊，年份，卷（期），起止页码】：Electronic Components and Technology Conference, 2005. Proceedings. 55th
Volume , Issue , 31 May-3 June 2005 Page(s): 1044 - 1049 Vol. 1
Digital Object Identifier 10.1109/ECTC.2005.1441400
【全文链接或论文所属数据库】：
http://ieeexplore.ieee.org/Xplor ... &isnumber=31024
【篇 号】：3
【作 者】：Yoon, H.-J.; Kim, J.-G.
【题 名】：
622-Mb/s Bidirectional SFP Optical Transceiver Using an Integrated WDM Optical Subassembly
【期刊，年份，卷（期），起止页码】：Advanced Packaging, IEEE Transactions on [see also Components, Packaging and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on]
Volume 31, Issue 2, May 2008 Page(s):423 - 428
【全文链接或论文所属数据库】：
http://ieeexplore.ieee.org/Xplor ... mp;isnumber=4512103
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本帖最后由 snowman8 于 2008-6-22 09:49 编辑 ]
